Series: IC398 - Open Top

Title: Chip Scale Package 0.50mm Pitch

Features 　 Open top socket for BGA / LGA / CSP packages with 0.50mm pitch 18 x 18 maximum grid size SMT soldering (0.50mm pitch) Open top type sockets for FBGA packages Depopulation versions available 　 　 Specifications 　 Insulation Resistance: 1,000M min. at 100V DC Dielec. Withstd. Voltage: 100V AC for 1 minute Contact Resistance: 100m max. at 10mA/20mV max. Operating Temp. Range: –40°C to +150°C Contact force: 6gf per pin approx. 　 　 Materials and Finish 　 Housing: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel

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