| Series: IC51 - Clamshell |
| Title: Shrink Small Outline Package (SSOP) |
| |
|
| Features |
|
- Pin counts 16, 20, 24, 28, 30, 32, 48 and 56
|
- Pitch sizes 0.6, 0.635 and 0.65mm
|
- Clamshell socket for SSOP
|
| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 500V DC |
| Dielec. Withstd. Voltage: |
700V AC for 1 minute |
| Contact Resistance: |
30m max. at 10mA/20mV max. |
| Operating Temp. Range: |
–40°C to +150°C
(type PSF)
–55°C to +170°C
(type PES & PEI) |
| Mating Cycles: |
10,000 insertions min. |
| |
|
| Materials and Finish |
|
| Housing: |
Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass- filled
Polyetherimide (PEI), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over Nickel | |
| Part Number |
Pin Count |
Pitch(mm) |
| IC51-778.AS-8409 |
14 |
0.65 |
| IC51-0162-911 |
16 |
0.65 |
| IC51-0162-778 |
16 |
0.65 |
| IC51-755.KS-7514 |
16 |
0.65 |
| IC51-0202-779 |
20 |
0.65 |
| IC51-755.KS-7631 |
20 |
0.65 |
| IC51-0242-913 |
24 |
0.65 |
| IC51-0242-761 |
24 |
0.65 |
| IC51-0282-673-1 |
28 |
0.65 |
| IC51-755.KS-13330 |
28 |
0.65 |
| IC51-0302-914 |
30 |
0.65 |
| IC51-0302-755 |
30 |
0.65 |
| IC51-0322-910 |
32 |
0.65 |
| IC51-1387.KS-15186 |
48 |
0.635 |
| IC51-0562-1387 |
56 |
0.635 |
| IC51-0722-1955-1 |
72 |
0.65 |
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