65 mm Pitch BGA Sockets
PRODUCT DESCRIPTION:
Plastronics now offers .65 mm pitch test and burn-in sockets for fine pitch BGA and CSP packages. This socket can accept packages up to 18 x 18 mm and a maximum 25 x 25 ball matrix. Plastronics� BGA sockets can be selectively loaded with only the exact number of pins required for a cost-effective burn-in solution.
SPECIFICATIONS (mm):
• Up to 25 x 25 Matrix
• Grid Array Pitch .65 x .65
• Max IC Size 18.00 x 18.00
• Solder Ball Sizes .30 +/- .05
.40 +/- .05
• Cover Actuation Force 1.19 Kg (avg.)
MECHANICAL PROPERTIES:
• Mounting Method to Board: Thru-hole Mount
• Socket Operation: ZIF (Push cover 3 mm stroke)
• Operating Temperature: -65°C to +150°C
• Contact Force: 10+/- 3 gf
• Life Cycles: 20,000 Mechanical Cycles
PHYSICAL PROPERTIES:
• Plastic Body: PEI
• Plastic Grid Plates: PEI
• Contact Base Metal: BeCu
• Contact Plating: Au over Ni
ELECTRICAL PROPERTIES:
• Contact Resistance: < 50 mOhm
• Inductance: < 6 nH
• Capacitance: < 2.59 pF
• Current Rating: 1A
• Volume Resistivity: 1,000 MOhm @ 100 VDC
• Insulation Resistance: 100 VAC for 1 minute
DETAIL DRAWINGS:
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